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Product NEWS

PDT-56 Entry Level Drop Tester

MADE EMEA Study - European Shipping Channels

Lansmont Chicago Train Study

Bulldozer Seat Comparison Study

Case Studies

The case studies and documents listed below contain information on various studies, and applications for Lansmont's line of test equipment and instruments.

Developing a Random Vibration Standard Random Vibration Test Standard

Presented at Dimensions 07 by Amgen Incorporation California.

The industry currently has no set standards on the way vibration data is collected and analyzed to develop vibration profiles. This presentation will describe how to develop random vibration profiles to meet your qualification needs. The presentation will also outline minimum equirements that should be met to develop a random vibration profile.

MADE - EMEA European Study Random Vibration Test Standard

This study builds upon the work conducted during the original MADE study in America.

"The concept was to ship instrumented packages via express carriers from various origins to various destinations in Europe. Acceleration, temperature, and humidity were recorded and used to calculate/interpret velocity change, drop height, impact orientation, and atmospheric conditions. One size and weight dummy package was shipped, and recorders (SAVER™ 3X90™) from Lansmont were used as the instrumentation."

MADE StudyChicago Train Ride Study

An extremely thorough study conducted across America in order to study the transport environment.

The Measurement and Analysis of the Distribution Environment (MADE) task group was established under P2C2 (Protective Packaging of Computer Components), a subcommittee of the Institute of Packaging Professionals (IoPP).

The group’s mission is to obtain a better understanding of the
distribution environment and share that knowledge with others. To make the study manageable, the domestic small parcel express environment was chosen as the “environment” to be examined.

Chicago 'L' Ride Lansmont StudyChicago Train Ride Study

In preparation for Pack Expo International 2006 Lansmont chose the famed Chicago Elevated (“L”) Rail Lines to help demonstrate newly available Lansmont technology that can be used to measure, compare and quantify the level of hazard or harshness present within transport environments.

Lansmont used their SAVER 9x30 Field Data Recorder along with companion SAVER GPS-Logger to measure key Chicago “L” ride quality metrics including:

  • Individual Bumps Occurring on Each of 8 “L” Lines.
  • Date and Time of Individual Event Measurements.
  • GPS Position of Individual Event Measurements.
  • Overall Vibration Harshness of Each “L” Line.
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    Transport Recorder Comparison Performance Study

    Two recorders are compared, the SAVER from Lansmont, and the EDR3 from Instrumented Sensor Technology (IST). Both are similar in size and weight, and both use internal triaxial accelerometers. The SAVER (“Unit A”) uses piezoelectric accelerometers, and the EDR3 (“Unit B”) uses piezoresistive accelerometers. Both recorders use the zero-G channel as the primary method for determining drop height.

    The purpose of this test was to evaluate both recorders for accuracy in calculating and reporting drop heights from a variety of situations using settings recommended by the manufacturers.

    Bulldozer Seat Comfort Comparison Comfort Study

    This field study evaluated a newer and older dozer at a construction site. Both dozers performed similar activities in the same location within the construction site. Two operators participated in this study. One operator used the older equipment and the other operator used the newer equipment.

    Jolting and jarring measurements were taken at the seat/operator interface and at the floor of the cab. The result of this field study indicates that the newer dozer was better than the older dozer.

    Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages Comfort Study

    Written by the United Test & Assembly Center Ltd (UTAC) in Singapore this paper explores the reliability of Lead versus Lead free soldered IC's during drop testing.

    Portable electronic products such as cellular phones, PDAs, and MP3 units are increasingly designed for
    accidental drop. Repeated drop events can lead to solder joint failure and malfunction of these products. Hence board-level reliability drop testing is a useful way to characterize the drop durability of the printed circuit board with different soldered assemblies.

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